Dr. Demetriou is a Senior Engineer at IBM Corporation in the IBM Systems’ Advanced Thermal Energy Efficiency Lab. He received a Ph.D. in Mechanical and Aerospace Engineering from Syracuse University. His research is focused on the analysis, application, and optimization of thermal management and energy conversion systems, particularly in the area of high-density data centers, high-performance buildings, and advanced electronics cooling technologies. Dr. Demetriou is the current Chair of ASHRAE Technical Committee 9.9 on Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment. He has co-authored four books in the ASHRAE Datacom Series, authored or coauthored over thirty journal and peer-reviewed conference publications, and has been granted nineteen United States patents. Dr. Demetriou holds an Associate Adjunct Professor position in the Department of Mechanical Engineering at Columbia University. He is also the Program Chair and former Finance Chair for the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) conference. His work has been awarded numerous honors, including the ASHRAE Willis H. Carrier Award, All-University Doctoral Prize at Syracuse University, IEEE TCPMT Best Paper Award, ASME Journal of Electronics Packaging Best Paper Award, ASME InterPACK Best Paper Award in Data Centers and Energy Efficient Electronic Systems, and the Best Paper in the International Journal of Building Simulations. He holds a MS in Mechanical and Aerospace Engineering from Syracuse University and a BS in Mechanical Engineering from Manhattan College.
6 hour
Designing & Operating Data Centers for the Internet of Everything: Mitigating Risk & Optimizing Performance